关键词：数据产权化，共享交易，权益分配

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A hybrid silicon micro-ring laser is a good candidate as light source for low cost and low power consumption data links [1]. However, thermal issues are one of major obstacles to achieve higher energy efficiency and higher integration density. The thick buried oxide (BOX) layer in silicon on insulator (SOI) has a poor thermal conductivity and blocks the heat dissipating into the heat sink. Furthermore ring lasers have a higher thermal impedance due to their small footprint, which makes the performance degrade rapidly at high temperatures [2]. In previous work we reduced device heating with a metal thermal shunt design [3]. In this paper we investigate better thermal management of hybrid silicon ring lasers with an optimized thermal shunt structure.

关键词：激光热分流；混合硅；热效应

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We report on low power consumption, high direct modulation speed performance of compact hybrid silicon microring lasers. By integrating a novel thermal shunt, device joule heating is significantly reduced, leading to low threshold, high continuous wave (cw) lasing temperature as high as 105 degC.

关键词：激光；混合硅；热效应

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Here we report a Si-Ge avalanche photodiode (APD) with a breakdown voltage of only -10V. The highest measured bandwidth is 15.8GHz for a 20μm diameter device. A bandwidth of 13.2 GHz at gain of 22.2 is obtained for the same device, giving a 290GHz gain-bandwidth product at 1550nm wavelength. 

关键词：低电压；光电二极管；APD

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关键词：图片芯片；双折射；图像处理；白平衡

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This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards.

关键词：电子封装；硅碳化物；温度传感器；芯片

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The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

关键词：芯片；可靠性；技术利用率

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We present a new concept for a beam position monitor with the unique ability to map particle beam position to a measurable wavelength. Coupled with an optical spectrograph, this beam position monitor is capable of sub-nanometer resolution. We describe one possible design, and through finite element frequency domain simulations, we show a resolution of 0.7 nanometers. Due to its high precision and ultra-compact form factor, this device is ideal for future x-ray sources and laser-driven particle accelerators 'on-a-chip'.

关键词：芯片；激光器；加速器；介电性能

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Next-generation processor architectures (multi-core, multi-threaded) hold the promise of delivering enormous amounts of compute power in a small form factor and with low power requirements. However, new programming models are required to realize this potential. Our objectives are to deploy data processing and vehicle control systems onto a variety of systems on a chip (SOC) to provide more autonomous functionality.

关键词：芯片；计算机编程；控制系统；数据处理

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Through a technical exchange with Delft University, the NUS research team has gained valuable knowledge and have achieved the first results with the electron-impact ion source system. Through this exchange, the team has achieved a realistic design for the ion source test bench which has produced its first beams at 3 keV and is currently being tested in Singapore. In a next stage, this system will be employed at ion energies of up to 200 keV. Electron beam calculations have been performed to evaluate different electron guns for their effectiveness in ionizing hydrogen gas molecules in our proposed configuration. Our calculations show that the proposed PBW system is expected to write as fast as commercial electron beam writing systems at sub 10nm, without proximity effects from nearby fabricated features. Several electron impact ionization chips have been designed and tested at Delft and Singapore. At the same time, the new proton beam writing beam line developed under previous grant efforts has been further improved and proton beams now can be focused to 13nm x 29nm.

关键词：芯片；原子来源；离子源

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