[计算机、通信和其他电子设备制造业] [2023-03-01]
光伏玻璃是生产太阳能电池组件所需的封装材料,其强度、透光率对光伏组件的寿命和发电效率有重要影响。根据制作工艺的不同,光伏玻璃可分为超白压延玻璃与浮法玻璃;其中,压延玻璃主要应用于晶硅太阳能电池组件,浮法玻璃主要应用于薄膜电池组件及晶硅系列双玻组件。近年来,在光伏组件大型化、轻量化以及双玻组件渗透率提升的发展趋势下,作为封装材料的光伏玻璃也正在向大型化与薄型化发展。
[计算机、通信和其他电子设备制造业] [2023-03-01]
FY23Q1 单季实现收入67.4 亿美元,处于指引上限(66.6-67.4 亿美元),同比+7%/环比-0.1%,主要系ICAPS 事业部(物联网、通信、汽车、电源和传感器)的强势抵消了内存和先进晶圆逻辑业务的下滑,公司在手订单连续第九个季度实现增长;FY23Q1 毛利率46.8%,同比-0.5ppt/环比+0.8ppt,符合预期;实现净利润17.2 亿美元,同比-3.91%/环比+8.2%。
[计算机、通信和其他电子设备制造业] [2023-03-01]
碳化硅性能优异,衬底为最核心环节:碳化硅材料性能突破硅基极限,相较于传统硅基器件,碳化硅功率器件的功率密度、开关效率和器件损耗上都有大幅度优化。碳化硅产品生产流程从材料端衬底与外延的制备开始,经历芯片的设计与制造,再到模块的封装后,最终流向下游应用市场。从成本拆分来看,衬底成本占比达46%,是产业链中最为核心的环节。目前衬底制备环节中,晶体生长环节,受碳化硅长晶速度慢,黑箱操作以及碳化硅晶体结构类型众多影响,导致碳化硅衬底产量小,良率低;在切割研磨抛光环节,由于碳化硅是高硬度的脆性材料,期切磨抛的加工难度增加,对碳化硅晶柱的材料利用率较低,产出晶片数量较少。上述难点造成了碳化硅目前制备成本较高,成为限制产业发展的瓶颈。未来随着衬底尺寸从6 寸向8 寸提升,持续优化良率以及相关生产切割、抛光工艺的的升级,碳化硅材料成本有望显著下降,将有效降低整体器件价格,提升下游客户的替代意愿,拉升碳化硅功率器件的市场渗透率。
[计算机、通信和其他电子设备制造业] [2023-03-01]
[信息传输、软件和信息技术服务业,计算机、通信和其他电子设备制造业] [2023-03-01]
[汽车制造业,仪器仪表制造业,计算机、通信和其他电子设备制造业] [2023-03-01]
The market study aims at estimating the market size and the growth potential of this market. Topics analyzed within the report include a detailed breakdown of the global markets for automotive pressure sensors by geography and historical trend. The scope of the report extends to sizing of the automotive pressure sensors market and global market trends with market data for 2021 as the base year, 2022 and 2022 as the estimate years and forecast for 2024 with projection of CAGR from 2024 to 2029.
[计算机、通信和其他电子设备制造业,汽车制造业,信息传输、软件和信息技术服务业] [2023-03-01]
The market study aims at estimating the market size and the growth potential of this market. Topics analyzed within the report include a detailed breakdown of the global markets for automotive cybersecurity by geography and historical trend. The scope of the report extends to sizing of the automotive cybersecurity market and global market trends with market data for 2021 as the base year, 2022 and 2022 as the estimate years and forecast for 2024 with projection of CAGR from 2024 to 2029.
[计算机、通信和其他电子设备制造业] [2023-02-28]
[计算机、通信和其他电子设备制造业,金融业,信息传输、软件和信息技术服务业] [2023-02-28]
The market study aims at estimating the market size and the growth potential of this market. Topics analyzed within the report include a detailed breakdown of the global markets for smart cards by geography and historical trend. The scope of the report extends to sizing of the smart cards market and global market trends with market data for 2021 as the base year, 2022 and 2022 as the estimate years and forecast for 2024 with projection of CAGR from 2024 to 2029.
[计算机、通信和其他电子设备制造业,医药制造业] [2023-02-28]
The market study aims at estimating the market size and the growth potential of this market. Topics analyzed within the report include a detailed breakdown of the global markets for 4d printing in healthcare by geography and historical trend. The scope of the report extends to sizing of the 4d printing in healthcare market and global market trends with market data for 2021 as the base year, 2022 and 2022 as the estimate years and forecast for 2024 with projection of CAGR from 2024 to 2029.