-
71.监控介质激光加速器上解决梁的位置的设计
[计算机、通信和其他电子设备制造业] [2015-09-09]
We present a new concept for a beam position monitor with the unique ability to map particle beam position to a measurable wavelength. Coupled with an optical spectrograph, this beam position monitor is capable of sub-nanometer resolution. We describe one possible design, and through finite element frequency domain simulations, we show a resolution of 0.7 nanometers. Due to its high precision and ultra-compact form factor, this device is ideal for future x-ray sources and laser-driven particle accelerators 'on-a-chip'.
关键词:芯片;激光器;加速器;介电性能
-
72.海洋研究中先进多核处理器技术的应用
[计算机、通信和其他电子设备制造业] [2015-09-09]
Next-generation processor architectures (multi-core, multi-threaded) hold the promise of delivering enormous amounts of compute power in a small form factor and with low power requirements. However, new programming models are required to realize this potential. Our objectives are to deploy data processing and vehicle control systems onto a variety of systems on a chip (SOC) to provide more autonomous functionality.
关键词:芯片;计算机编程;控制系统;数据处理
-
73.大型多核系统互连网络的可重构片
[计算机、通信和其他电子设备制造业] [2015-09-08]
We proposed a reconfigurable architecture for networks-on-chip (NoCs) on which arbitrary application-specific topologies can be implemented. Since entirely different applications may be executed on a SoC at different times, the on-chip traffic characteristics can vary significantly across different applications. However, almost all existing NoC design flows and the corresponding application-specific optimization methods customize NoCs based on the traffic characteristics of a single application. The reconfigurability of the proposed NoC architecture allows it to dynamically tailor its topology to the traffic pattern of different applications.
关键词:芯片;NoC架构;拓扑结构
-
74.光学波导的基本原理和设计指南
[计算机、通信和其他电子设备制造业] [2015-09-08]
Next-generation high-end data processing systems such as Internet switches or servers approach aggregate bandwidth in excess of 1 Tb/s. The task of providing hundreds of individual links as speeds in excess of 10 Gb/s over the link distances becomes increasingly difficult for conventional copper-based interconnect technology. Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on chip, PCB, and system levels. They carry data signals as modulation of optical intensity, through an optical waveguide, thus replacing traditional electrical interconnects. Optical devices can overcome the bottleneck imposed by the limited bandwidth of electronic circuits in areas such as computing, data storage, or telecommunication networks. The basic element of any optical circuit is the optical waveguide, which permits to connect optically different devices. To build integrated optical circuits that substitute micro-electronic circuits, integrated optical waveguides with light confinement in a size of the order of the wavelength are mandatory. Optical waveguides can be classified according to their geometry (planar, strip, or fiber waveguides), mode structure (single-mode, multi-mode), refractive index distribution (step or gradient index) and material (glass, polymer, or semiconductor). They are designed as energy flow only along the waveguiding structure but not perpendicular to it, so radiation losses can be avoided. Usually, optical integrated waveguides rely on the principle of total internal reflection, using materials with low absorption loss. The waveguide cross section should be as small as possible to permit high-density integration, functionally linking devices or systems or implementation of complex functionalities, such as splitters/combiners, couplers, AWGs, and modulators. A wide range of materials can be used, with then-corresponding advantages and drawbacks. Current commercial devices are mostly based on silicon/silica waveguides, Ⅲ-Ⅴ compounds, and lithium niobate waveguides. Silicon waveguides offers the possibility of mass-manufacturing and a high level of integration, which would result in cheaper chips. Novel materials such as photonic crystals can provide advantages to fulfill the requirements for high-density photonic integration. This chapter will review fundamentals and design guides of optical waveguides, including state-of-the-art and challenges, fundamental theory and design methodology, fabrication techniques, as well as materials selection for different level waveguide components and integration structures.
关键词:芯片电路;集成光波导;光约束
-
75.通过动态生态系统发展促进纳米生物技术商业化:桥接创新政策、利益相关者和知识
[科学研究和技术服务业] [2015-09-08]
The application of nanotechnology in the field of biology has given rise to a host of innovations ranging from diagnostics, biomedical sensors, targeted drug delivery systems, to the creation of integrated chips with scalable memory. Recently, increased investments in basic nanotechnology research and demand for improved convergence based product development, have led to the organization of national innovation ecosystems such as the National Nanotechnology Initiative in the United States, National Nanotechnology Initiative and associated National Nanotechnology Centre in Malaysia and the Australia Nanotechnology Network in Australia to name a few. While academic laboratories and spin-offs have served as epicenters of nanobiotechnology commercialization across these countries, the extent of commercialization of products across developed and emerging economies is largely driven by the maturity of innovation networks and knowledge flows surrounding the nanobiotechnology initiatives. In the wake of the global market challenges of the biopharmaceuticals, successful deployment of nanobiotechnology innovations in regional economies will depend on inclusive and adaptable innovation models that can be replicated globally. To that end, this commentary discusses the design of a hybrid innovation ecosystem that captures nanotechnology policy, stakeholders, and knowledge to facilitate accelerated nanobiotechnology commercialization. Examples of innovation ecosystems in the US, Malaysia and Australia are used to demonstrate the emergence of this hybrid model where research and human capacity development including knowledge dissemination between the participating stakeholders, are the overarching goals of the designed ecosystems. Objective of Commentary: In the context of the limitations of existing innovation models as static entities that have failed to accelerate innovation and commercialization of nanotechnology innovations in medicine, an adaptable hybrid ecosystem or AHE for effective commercialization of nanomedicine and emerging technologies is proposed . The adaptable hybrid ecosystem builds upon the concepts of National Systems of Innovation, Triple Helix Model and strategic arenas-a broad area of focus that engages contributions from multidisciplinary areas. The multistakeholder participatory approach of the AHE model is suggestive of a dynamic asset pool comprising customers, industries, universities and international governments that enable technology commercialization in emerging areas such as nanomedicine and nanotechnology by the influence of fundamental paradigm shifts discussed in this paper.
关键词:芯片设备;创新三螺旋模型;混合模型
-
76.电热聚合物
[计算机、通信和其他电子设备制造业] [2015-09-08]
When an electric field is applied to a dielectric material, it will induce a change in the material's polarization. The consequent changes in the entropy and/or temperature of the material are referred to as the electrocaloric effect (ECE). The ECE may provide an efficient means to realize solid-state cooling devices for a broad range of applications such as on chip cooling and temperature regulation for sensors and electronic devices, provided that materials with large ECE can be developed. Refrigeration based on the ECE approach is more environmentally friendly and hence may also provide an alternative to the existing vapor-compression approach.
关键词:电子芯片冷却;温度调节设备;聚合物
-
77.三个异步平交路口ADC芯片设计的性能比较
[计算机、通信和其他电子设备制造业] [2015-09-08]
In this paper one convetional and two novel designs of 4-bit LCADCs are presented and simulated. The performance of these three circuits are estimated using CadenceVirtuoso?circuit simulation software to model the circuits at the transistor level. The three circuits are then compared in terms of timing accuracy, reference voltage accuracy, total power consumed, and total required area. The proposed integrator LCADC was found to have the lowest power consumption and the least error over one cycle but accumulated error over time. The proposed track and hold LCADC had slightly more timing error and power consumption, but it did not accumulate error and required significantly less area. Therefore the track and hold LCADC was chosen as the best implementation of the three studied in this paper.
关键词:平交路口能耗;芯片面积;测量精度
-
78.DNA微阵列图像的网格方法
[计算机、通信和其他电子设备制造业] [2015-09-08]
Image processing and analysis are two important aspects of DNA microarrays, since the aim of the whole experimental procedure is to obtain meaningful biological conclusions, which depend on the accuracy of the different stages, mainly those at the beginning of the process. DNA microarray images are obtained by scanning DNA chips at high resolution and are composed of sub-grids of spots. Although in many cases, based on the layout of the printer pins, the number of sub-grids or spots are known, due to misalignments, deformations, artifacts, or noise while producing the microarray images, these data may not be accurate or available. In this chapter, the gridding problem in DNA microarray images is addressed. In this direction, different methods for separating sub-grids and identifying spot centers in DNA microarray images are reviewed. Conceptual and experimental comparisons of some of these methods are also discussed.
关键词:DNA芯片;高分辨率;sub-grids斑点
-
79.生物纳米传感器的磁应用
[计算机、通信和其他电子设备制造业] [2015-09-08]
In the past years, self assembling has been employed to transform two-dimensional (2D) layers into compact three-dimensional (3D) architectures by roll-up of strained nanomembranes. This method has shown to be suitable for the development of versatile on chip devices of customized size and geometry synergetically combining magnetic, electronic, optical and fluidic functions. Various rolled-up magnetic nanomembranes have been fabricated consisting of either magnetic layers with in-plane easy axis of magnetization, i.e. Permalloy, Fe_3Si, Co, Co/Cu or coiled-up initially out-of-plane magnetized Co/Pt multilayers revealing magnetic patterns not existing in nature. More recently, such rolled-up magnetic architectures were applied as compact magneto-electronic devices, in the study of spin-wave interference and in GMR devices, e.g. for the in-flow detection of magnetic objects. In this chapter, we will highlight the most important results of rolled-up magnetic nanomembranes obtained during the last years.
关键词:多功能芯片;射流功能;生物传感器
-
80.HPC系统异构网络安全中CMPs的使用
[计算机、通信和其他电子设备制造业] [2015-09-08]
As technology scales, the International Technology Roadmap for Semiconductors projects that the number of cores will drastically increase to satisfy the performance requirements of future applications. Performance improvements brought by multi-core architectures have already been used in network security processors either using homogeneous chip multiprocessors (CMP) or through custom system-on-a-chip (SoC) designs. However, homogeneous CMPs provide only one type of core to match various application requirements, thereby not fully utilizing the available chip area and power budget. On the other hand, the heterogeneous CMP is a better option for a network security processor with programming needs ranging from encryption/decryption to content processing, as it allows the processor to better match the execution resources of application needs. This chapter explores the possibility of using heterogeneous CMPs for network and system security. More specifically, we propose an integer linear programming (ILP)-based methodology to mathematically analyze and provide heterogeneous CMP architectures and task distributions that can reduce the energy consumption of the system. Our results indicate that the proposed approach generates better results when compared to a homogeneous counterpart.
关键词:CMP元件;安全处理器编程;加密/解密内容处理