In the recent times, many nations, notably the NATO members, have begun to invest heavily in autonomous military systems. Though the focus had been largely on the unmanned aerial vehicles, the investments in the development of UGVs have also grown recently. In the United States, Defense Advanced Research Projects Agency (DARPA) has been investing heavily in the UGV technologies. The United States recently called upon defense contractors to innovate more in the area of UGVs, military robots, and drones to focus on improvements on easily upgraded software rather than hardware that can take years to come to the market. It aims to make use of 3D printing to speed up the process. This shows that the investments in R&D are expected to increase for UGVs in the coming years.

Memory devices employ a broad range of the packaging technology from flip-chip, lead-frame, wire-bond to through-silicon via (TSV). With the decrease in dimensions and increase in the chip functionality, a higher number of the electrical connections have to be made to the external circuit. This has also lead to a development in packaging technologies. Flip chip, TSV, and Wafer-level Chip-scale Packaging (WLCSP) are promising technologies to satisfy wider bandwidth, faster speed, and smaller/thinner package. Comprehensible program adjustments, low engineering costs, and easy changeovers are fueling the demand for the wire-bond memory packaging platform.

The wide range of applications for x-rays, such as for bone fractures, infections (pneumonia), calcifications, tumors, arthritis, dental, heart, blood vessel blockages, digestive, cysts, cancer, asthma, lung diseases, etc., indicates the broad range of diagnostic and therapy applications of x-rays that have kept the demand in the market alive. Additionally, radiological equipment has a fixed life cycle span, that results in unavoidable breakdown and degradation or loss of image quality that may render the equipment useless after a certain time period. In medical applications, equipment older than 10 years are not considered as state-of-the art equipment and replacement becomes essential. This creates demand for the replacement of x-ray imaging equipment from medical centers, labs, hospitals, and professionals.

The non-invasive diagnostic imaging techniques are witnessing high demand, primarily for soft tissue diagnosis. These unmet demands are the factors driving the magnetic resonance imaging market’s growth. Furthermore, factors, such as technological advancements, like the inclusion of MRI with PET or CT, to provide imaging possibilities with less exposure to harmful radiations, rising adoption of MRI in developing countries, and availability, along with rising adoption of universal health coverage in the developed and developing markets, are aiding the growth of the market studied.

The translation market is witnessing excess demand, as a result of the increasing use of computer-assisted tools. The necessity to use the technology in favor of the more efficient translation process is, therefore, continuously increasing. This continuous increase can be attributed to the growth of emerging economies and the internationalization of many businesses that want to provide their content, products, and services in as many languages as possible. This requirement might prompt translation companies to rely increasingly on machine translation, as a tool.

LCoS-based products, which offer higher quality and more precise results than competing microdisplay technologies, such as liquid crystal display (LCD) and digital light processing (DLP), are being preferred by component manufactures. Therefore, increasing demand for high resolution display is supporting the growth of the liquid crystal on silicon (LCoS) display market. Compatibility with wide range of products, an open technology platform, and superiority in terms of competing technology are some of the major drivers for market growth.

The first link discussed in this industry value chain is research and product development. This is one of the most important links in the LiDAR industry, as it defines the final design and performance characteristics of the deployed product. In this link, a study is conducted to analyze the requirements of the system and the parameters to be met to perform as desired. Once the required data is gathered from research, a test module is developed based on the available data. The system is then designed to meet the requirement. The test module is then passed through vigorous testing to analyze the performance of the system. The product is then improved depending on the text results till a finalized version of the system is produced. Then the product moves to the next link in the value chain.

Moreover, the market has not seen any significant investment from any of the major players, due to which, the progress in developing a mass adoptable product has not materialized. The positive signs for this market have been the recent innovative progress made by institutes. This innovation has led to the opening up of new applications of this technology. Most recently, in March 2019, a group of researchers from the Indian Institute of Science, Bangalore, and University of Cambridge, demonstrated flexible electronics' self-repairing capabilities.

The factors driving growth of the market studied include - the rising demand for miniature electronic devices and increasing adoption of SoC technology across various industries, such as automotive, IoT, and AI. The upcoming trend of EDA toolset with machine learning capabilities also contributes to the growth of the market studied. Significant investments have been made during 2017-2018, which are also aimed at empowering designers for the reduction of the number of errors, thereby saving significant time.