Memory devices employ a broad range of the packaging technology from flip-chip, lead-frame, wire-bond to through-silicon via (TSV). With the decrease in dimensions and increase in the chip functionality, a higher number of the electrical connections have to be made to the external circuit. This has also lead to a development in packaging technologies. Flip chip, TSV, and Wafer-level Chip-scale Packaging (WLCSP) are promising technologies to satisfy wider bandwidth, faster speed, and smaller/thinner package. Comprehensible program adjustments, low engineering costs, and easy changeovers are fueling the demand for the wire-bond memory packaging platform.

1. INTRODUCTION

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MEMORY PACKAGING MARKET INSIGHTS

5. MEMORY PACKAGING MARKET DYNAMICS

6. MEMORY PACKAGING MARKET SEGMENTATION

7. KEY VENDOR PROFILES

8. Investment Analysis

9. Future of Memory Packaging Market