Equipment Type: Solid state motor controllers (all voltages) Industry: Electrical equipment manufacturing

Equipment Type: Other low voltage switchgear apparatus, 1000 volts or less Industry: Electrical equipment manufacturing

Equipment Type: Switch, outlet, FM/TV, and telephone wall plates Industry: Wiring device manufacturing

Equipment Type: Other switches, 1000 volts or less Industry: Electrical equipment manufacturing

Equipment Type: Other knife switches, 1000 volts or less Industry: Electrical equipment manufacturing

Equipment Type: Heavy duty knife switches, 1000 volts or less Industry: Electrical equipment manufacturing

Equipment Type: General purpose relays, over 100 MV and sealed Industry: Electrical equipment manufacturing

The equipment described in this report are primarily defined by its title since the title is generally long and includes most of the criteria used to differentiate the equipment from other similar equipment. The equipment descriptions are sourced from the U.S. Census. Additionally descriptions can be collected from the manufacturing industry descriptions that each equipment is categorized. The U.S. Census manufacturing industry descriptions for equipment are listed below

The equipment described in this report are primarily defined by its title since the title is generally long and includes most of the criteria used to differentiate the equipment from other similar equipment. The equipment descriptions are sourced from the U.S. Census. Additionally descriptions can be collected from the manufacturing industry descriptions that each equipment is categorized. The U.S. Census manufacturing industry descriptions for equipment are listed below

英伟达 H200 搭载了 141GB 的 HBM3E，带宽达 4.8TB/s，相较于搭载 80GB HBM3 的 H100， 实现 76.25%的内存容量提升和 43.28%的内存带宽增长。与 H100 相比，在其他参数基本没变的背景下，H200 更高容量、更高带宽的 HBM3E 的搭载，在显著提升其性能的同时，有效降低了大模型训练时的能耗和总成本。作为 AI 算力之基石，HBM 产品容量和代际水平能够显著影响 AI 芯片的性能指标。