The global fusion splicer market is expected to grow at a CAGR of 8.93% during 2016-2020. In 2015, the telecommunication segment was the highest contributor to the overall market, with a 63.83% market share. The demand for fusion splicers is growing in the segment, which is expected to expand its presence further in the global market. The fiber-optic technology uses thin strands of glass or plastic called optical fibers. Optical fibers use light to transmit information between two places. An optical fiber is a thin cylinder of dielectric material, which is capable of transmitting messages modulated onto light waves. Fusion splicers are used to join two optical fibers using heat. They offer high-strength, permanent, and low-loss joint, and plays an important role in the optical network.

The suppression or filtering of electromagnetic noise in connectors can be achieved by adding diodes and capacitors to separate interfering high-voltage or high-frequency noise from the desired lower frequency signals. These connectors are called filtered connectors and have been used in the industry for more than three decades to provide cost- and space-effective solutions to EMI problems. They can be used in multiple applications such as satellites, avionics systems, communications, missiles, consumer electronics, and medical instruments.

Cable accessories form an integral part of power cable systems; these are essential components in the power cables used in the transmission and distribution of electricity, from the point of generation to the point of consumption. Depending on the operating voltage level, power cables can be categorized as low voltage (below 1 kV), medium voltage (1 kV to 33 kV), and high voltage (above 33 kV). The cable accessories also vary in terms of technical specifications based on voltage level application.

Growing global population and increase in per capita income in emerging economies lead to a rise in the demand for food products. The world population is estimated to reach 9.48 billion by 2050 from 7.4 billion in 2016. As a result, farmers are shifting toward mechanization through the use of agricultural machinery, to gain efficiency and effectiveness in farming and crop production. Globally, most governments are encouraging farmers by providing easy credit availability and various loans to buy agricultural machinery.

There has been a decline in the consumption of neoprene products in specific applications where substitution has occurred for the most part by rubbers like ethylene propylene diene monomer, which has led to a moderate growth rate of the neoprene market. The neoprene market stayed stagnant in the previous 14 years in the developed markets of North America and Western Europe. Although the financial parameters have some effect, neoprene has been under pressure from elastomers such as thermoplastic elastomers, ethylene propylene diene monomer, and polyurethane elastomers, which have eaten into the conceivable growth of neoprene products.

LDMs were introduced in the market as early as 1993, as a replacement for measuring tape. Leica Geosystems, which was acquired by Hexagon in 2005, was among the first companies to commercially launch handheld LDMs. Over the past 20 years, LDMs have seen a lot of advances in terms of accuracy, size, and weight. As the fabrication cost of semiconductors has fallen over the years, the ASP of LDMs has also come down. A LDM, which used to cost $300 in early 2000, is available at $100 with same features. There are high-end LDMs like Bosch GLR 825, Fluke 424, and Leica S910 that cost more than $300. To justify the higher price, they offer additional features like angle measurement, Pythagoras function (to measure indirect dimensions when the line of sight is obscure), and camera for a 4x zoom. Laser distance meters are used in different industries such as construction and real estate. They have applications like finding out electrical wiring and furniture length in carpentry, interior designing, and carpet flooring. Professional contractors such as solar energy solution providers are widely using them for panel installation and commissioning. The

Lead-acid batteries power 75%-85% of the electric forklifts manufactured globally. These batteries are cost-effective and offer benefits such as high resilience in difficult environmental conditions involving dirt, chemicals, and vibrations. The maintenance costs of lead-acid batteries can be monitored and improved with inexpensive technology to reduce the total cost of ownership. Advanced charging technologies can bring up the efficiency to 90%, with power factors approaching 99%. This keeps utility costs low. Technical innovations such as fast and opportunity charging during operator downtime add to the cost efficiency of lead-acid batteries.

EVA is produced by the copolymerization of 90%-60% ethylene and 10%-40% vinyl acetate. EVA is tough and elastic and is three times more flexible than its counterparts such as LDPE. Excellent barrier properties, waterproof properties, stress-crack resistance, and low-temperature toughness are some of the other properties of EVA. EVA is used for the production of hot-melt adhesives. It is also used in biomedical engineering for the manufacture of drug delivery devices. EVA is also known as foam rubber or expanded rubber and used in sports shoes as a shock absorber. The foam is also used as a padding in sports equipment such as boxing gloves, helmets, ski boots, wakeboard boots, fishing reel handles, fishing rods, and hockey pads.

Semiconductor materials such as plastic, metal, and ceramic components are used for fabrication and packaging purposes. They can be broadly classified into two types: fab materials and packaging materials. Fab materials are used in different stages of the fabrication process such as etching, oxidation, deposition, and planarization, whereas packaging materials are specifically used for packaging purposes, to increase the reliability of semiconductors. Semiconductor packages protect the fabricated IC on the semiconductor die from external mechanical impact and corrosion and interconnect the die and printed circuit board. Packaging materials provide many advantages to semiconductors, such as reduced packaging footprints and reduced output-signal inductance.