Systems for re-annotations of DNA microarray data for supporting analysis of results of DNA microarray experiments are becoming important elements of bioinformatics aspects of gene expression based studies. However, due to the computational problems related to the whole genome browsing projects, available services and data for re-annotation of microarray probes are still quite sparse. The difficulty in developing systems of re-annotations of microarray probe sets is mainly in huge sizes of probe set data. That's why we decided to create a effective tool for re-annotation task that will be able to work with such data and could be applied to any species. In our research we have created an efficient re-annotation method by combining the well known gene search tool BLAT with appropriately designed database. The elaborated system extends possibilities of existing re-annotation tools in the sense that: (1) by tuning parameters of all steps of re-annotation procedure any Affymetrix microarray standard chip can be automatically re-annotated in few hours, (2) several Affymetrix microarray chip standards are already precomputed.

关键词：芯片；微阵列表达数据；分类算法

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Smart grid has become a revolution to our lives. Energy meters provide the basic information of smart grid, including active power/reactive power/apparent power and corresponding energy, RMS values of voltage and current, harmonic information, etc. The meter computes all these items and communicates with other meters or the gateway [1,2]. Therefore, the integrated circuit chips inside the meter must have the ability to accomplish all these functions.

关键词：电路芯片；智能电网；低功率

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Integration of ferrite films on to the structures of on-chip RF inductor becomes essential for enhancement of inductance density. Here, we will demonstrate low-temperature deposition of ferrite film and its use to attain very high inductance density (680 nH/mm~2 at 5 GHz and 450 nH/mm~2 at 10 GHz).

关键词：薄膜；电感器；射频芯片

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As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection applications. Photonics, which has a fundamentally different mechanism of signal propagation, offers the potential to not only overcome the drawbacks of electrical signaling, but also enable the architect to build energy efficient, scalable systems. The purpose of this book is to introduce computer architects to the possibilities and challenges of working with photons and designing on-chip photonic interconnection networks.

关键词：芯片；纳米光子学；网络互连；光学互连网络

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The previous examples show the use of nanomaterials in biosensing due to their high surface to volume ratio, ability to detect the analyte from small volumes, and large signal to noise ratio, especially the wireless nanosen-sors that transfer message through the mobile. Moreover, nanosensors exhibit fast response time due to their high sensitivity toward the target substance. The trend towards the use of nanomaterials for biosensing applications in the present time describes the possible outcome of nano-chips in the near future containing different nanostructures that will be used for the detection of various analytes at the same time. This is possible by using the same nanomaterial containing different independent single nanocrystals on the same chip, and these can be functionalized separately with different biosensitive materials, detecting their respective target analytes simultaneously.

关键词：纳米晶体；共同芯片；生物灵敏度

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Currently, fabrication of vertical connections through silicon substrates is a significant challenge in three-dimensional (3D) assembly of Si IC. In particular, high aspect ratio of over ?10, taper free through vias with micron ～ tens micron diameters in silicon chips are a critical issue for this 3D technology. We report on drilling though vias in silicon chips by use of　1.5 femtosecond Bessel beams, which is transparent to Si, in air and AgNO_3 solutions, respectively. Compared with conventional fabrication methods using Gaussian beams, our technique allows us to perform high performance hole drilling with taper-free structures and without sample translation during the drilling, which can be potentially used for future 3D packages and 3D integration of silicon chips.

关键词：芯片；飞秒激光；贝塞尔光束

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The new generation of microprocessors incorporates a huge number of cores on the same chip. Graphics processing units are an example of this kind of architectures. We analyze these architectures from a theoretical point of view using the K-model to estimate the complexity of a given algorithm defined on this computational model. To this end, we use the K-model to derive an efficient realization of two popular algorithms, namely prefix sum and sorting.

关键词：微处理器；多核芯片；数据算法

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Embedded memory plays a big role in digital systems applications due to the increase of the data size required by many of these applications, such as video games and communication protocols. Also, the ever-increasing gap between processor speed, main memory, and bus speed (memory wall) creates a need for more on-chip memory to keep the processor busy and increase throughput. In addition to the increase of processor frequency, the integration of many cores or functional units on the same chip, which is referred to as system on chip (SOC), requires larger memory size. Embedded memory compromises more than 50 % of the chip area and greater than 80 % of transistor counts. Increased process variation due to technology scaling and the desire for high density memory results in a big challenge to meet the stringent requirements on performance, power, and yield. Embedded memory does not only play a positive role in system performance, but it also has an impact on yield, timing, and power. Memory organization and early decision made by system level and architecture group have big influence on the role and the impact the memory has on the overall system. Tradeoffs from memory cell type, array organization, memory hierarchy, Design for Test, and overall memory subsystem have to be considered early on.

关键词：系统芯片；高密度存储器；性能优化

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The ability to perform laboratory operations on a small scale using miniaturized lab-on-a-chip (LOC) devices is a promising biosensing technique. The advantages of LOC are the small time of analysis, the low reagent costs, and the reduced amount of chemical wastes. The application of portable, easy-to-use, and highly sensitive LOC biosensors for real-time detection could offer significant advantages over current analytical methods. Integrated optics-based biosensors have become the most suitable technology for LOC integration due to their ability for miniaturization; their extreme sensitivity, robustness, and reliability; and their potential for multiplexing and mass production at low cost.

关键词：生物传感器；芯片；控制技术

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A wave of parallel processing research in the 1970s and 1980s developed various techniques for concurrent task scheduling, including work-stealing scheduling and lazy task creation, and various ideas for supporting speculative computing, including the sponsor model, but these ideas did not see large-scale use as long as uniprocessor clock speeds continued to increase rapidly from year to year. Now that the increase in clock speeds has slowed dramatically and multicore processors have become the answer for increasing the computing throughput of processor chips, increasing the performance of everyday applications on multicore processors by using parallelism has taken on greater importance, so concurrent task scheduling techniques are getting a second look. Work stealing and lazy task creation have now been incorporated into a wide range of systems capable of "industrial strength" application execution, but support for speculative computing still lags behind. This paper traces these techniques from their origins to their use in present-day systems and suggests some directions for further investigation and development in the speculative computing area.

关键词：处理器芯片；多核处理器；并行任务

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