关键词：半导体；半导体硅片；加工；组装；测试；掺杂剂活化；金属回流
摘 要：The manufacture of semiconductors involves semiconductor silicon wafer production, wafer processing, assembly, and testing. Rapid thermal processing refers to the heating of silicon wafers to temperatures above 2192 degree Fahrenheit within seconds to attain nitridation, dopant activation, metal reflow, thermal oxidation and chemical vapor deposition within the silicon wafer of a semiconductor. The silicon wafers are heated using either lamps or lasers. Rapid thermal processing equipment offers advantages such as lower power consumption and cost savings. Rapid thermal annealing equipment is used to activate dopants in the wafer and for interfacial reaction of metal contacts. Rapid thermal processing has been gaining popularity among semiconductor manufacturers because of its use in circuit processing, CMOS production, and in the Microelectronics industry.
目 录：

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

03.1 Market Overview

03.2 Product Offerings

04. Market Research Methodology

04.1 Market Research Process

04.2 Research Methodology

05. Introduction

06. Market Landscape

06.1 Semiconductor Industry Value Chain

06.2 Market Overview

06.3 Market Size and Forecast

06.4 Equipment Use and Classification

06.5 Five Forces Analysis

07. Geographical Segmentation

07.1 Segmentation of Global Rapid Thermal

Processing Equipment Market by Geography

2014-2019

07.2 Rapid Thermal Processing Equipment Market in

APAC Region

07.2.1 Market Size and Forecast

07.3 Rapid Thermal Processing Equipment Market in

Americas

07.3.1 Market Size and Forecast

07.4 Rapid Thermal Processing Equipment Market in

EMEA Region

07.4.1 Market Size and Forecast

08. Key Leading Countries

08.1 Taiwan

08.2 Japan

08.3 South Korea

09. Buying Criteria

10. Market Growth Drivers

11. Drivers and their Impact

12. Market Challenges

13. Impact of Drivers and Challenges

14. Market Trends

15. Trends and their Impact

16. Vendor Landscape

16.1 Competitive Scenario

16.2 Market Share Analysis 2014

16.3 Other Vendors

17. Key Vendor Analysis

17.1 Applied Materials

17.1.1 Key Facts

17.1.2 Business Overview

17.1.3 Business Segmentation by Revenue 2013

17.1.4 Business Segmentation by Revenue 2012 and 2013

17.1.5 Geographical Segmentation by Revenue 2013

17.1.6 Business Strategy

17.1.7 Recent Developments

17.1.8 SWOT Analysis

17.2 Hitachi Kokusai Electric

17.2.1 Key Facts

17.2.2 Business Overview

17.2.3 Business Segmentation by Revenue 2014

17.2.4 Geographical Segmentation by Revenue 2014

17.2.5 Business Strategy

17.2.6 Recent Developments

17.2.7 SWOT Analysis

17.3 Mattson Technology

17.3.1 Key Facts

17.3.2 Business Overview

17.3.3 Key Technologies

17.3.4 Geographical Segmentation by Revenue 2013

17.3.5 Business Strategy

17.3.6 Recent Developments

17.3.7 SWOT Analysis

17.4 SCREEN

17.4.1 Key Facts

17.4.2 Business Overview

17.4.3 Business Segmentation by Revenue 2014

Business Segmentation 17.4.4 by Revenue 2013 and 2014

17.4.5 Geographical Segmentation by Revenue 2014

17.4.6 Recent Developments

17.4.7 SWOT Analysis

17.5 Ultratech

17.5.1 Key Facts

17.5.2 Business Overview

17.5.3 Segmentation by Revenue 2013

17.5.4 Segmentation by Revenue 2012 and 2013

17.5.5 Geographical Segmentation by Revenue 2013

17.5.6 Business Strategy

17.5.7 Recent Developments

17.5.8 SWOT Analysis

18. Other Reports in this Series