关键词：COM；系统模块；单板计算机；嵌入式计算机系统；COM模块；各种嵌入式；应用
摘 要：A COM, or system on module (SOM), is a single board computer, which is a subtype of an embedded computer system. COMs are used in various embedded applications such as industrial automation, medical equipment, gaming devices (slot machines), servers, workstations, and rackmounts. They are built on a single circuit board and consist of a single processor, random access memory (RAM), and input and output controllers. However, COMs lack the standard connectors required for connecting input/output peripherals to the board. Hence, they need to be mounted on a carrier board to connect to standard peripheral connectors. Certain COMs have peripheral connectors and do not require a carrier board. In certain configurations, the baseboard is connected to a backplane, which allows connectivity to other peripheral devices. Also, some rackmount computer designs that use COMs use backplane connectivity.
目 录：

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Market overview

Definitions

Top-vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

Standards

Go-to-market approach using COM: The OEM's

perspective

PART 05: Market landscape

Market overview

Market size and forecast by shipment

Market size and forecast by revenue

Five forces analysis

PART 06: Market segmentation by application

COM for industrial automation segment

COM for medical segment

COM for transportation segment

COM for gaming segment

COM for communication segment

COM for others segment

PART 07: Market segmentation by standard

COM for COM Express segment

COM for SMARC segment

COM for Qseven segment

COM for ETX segment

COM for other standards segment

PART 08: Geographical segmentation

COM market in EMEA

COM market in Americas

COM market in APAC

PART 09: Market drivers

Increased demand for fast product development

Longevity and reliability of COMs

Multichannel retailing

PART 10: Impact of drivers

PART 11: Market challenges

Failure in forecasting market demand

High lead time

High risk factors

PART 12: Impact of drivers and challenges

PART 13: Market trends

Advances in transistor technology

Emergence of IoT

Growing market for small SWaP designs

PART 14: Vendor landscape

Competitive scenario

Pricing for COMs

TCO of developing COMs in-house

Sector independence

Congatec

Kontron

MSC Technologies

Other prominent vendors

PART 15: Appendix

List of abbreviations

PART 16: Explore Technavio