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从泊松到硅——推进紧凑香料为IC设计模型

From Poisson to Silicon - Advancing Compact SPICE Models for IC Design
作者:Sriramkumar Venugopalan 作者单位:University of California at Berkeley 加工时间:2013-11-23 信息来源:EECS 索取原文[150 页]
关键词:半导体工业;集成电路设计;多金属氧化物;半导体场效应;晶体管器件
摘 要:The semiconductor industry has relied on accurate device models for analyzing, predicting and innovating integrated circuit design.Multi-gate MOSFET device architectures like FinFETs are beginning to replace their planar MOSFET counterparts at the 22 nm technology node to enable continued technology scaling. Vertical cylindrical gate (CG) MOSFET are touted to replace planar MOSFETs as the memory device for DRAM and NAND Flash offering increased area density.
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