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低Tg高分子多模光波导的高效共晶焊接设计指南

Design guidelines for efficient eutectic soldering onto low Tg polymeric multimode light waveguides

作者:Meriem Ben Salah Ep Akin;Lutz Rissing;Elke Pichler 作者单位:EECS Department, University of California, Berkeley 加工时间:2015-05-03 信息来源:EECS 索取原文[9 页]
关键词:光波导;多模;聚合物;共晶焊接;Tg
摘 要:In this work, we conduct a numerical investigation of the structural feasibility of a flexible, monolithic and planar opto-electronic system based on low Tg polymers using ANSYS?. In particular, we explore the effectiveness of two eutectic compounds 52w.%In 48w.%Sn and 58w.%Bi 42w.%Sn to solder light sources and sinks to multimode light waveguides. First, we analyze the warpage of the optical structures due to eutectic soldering. Furthermore, we study the spectrum of mechanical stresses within the eutectic layer. Then, we investigate the possibility of roll-to-roll mass production. Finally, we establish design guidelines for decreasing the system warpage, and consequently preserving optical alignment, while complying with the ultimate shear strength of the eutectic material.
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