Packaging Technologies for High Temperature Electronics and Sensors
作者：Chen, L. Y.; Hunter, G. W.; Neudeck, P. G.; Beheim, G. M.; Spry, D. J.; Meredith, R. D. 作者单位：National Aeronautics and Space Administration, Cleveland, OH. NASA John H. Glenn Research Center at Lewis Field. 加工时间：2015-09-09 信息来源：科技报告（NASA） 索取原文[7 页]
关键词：电子封装；硅碳化物；温度传感器；芯片 摘 要：This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards.
索取原文[7 页]
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