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全球半导体检测系统市场报告(2016-2020年)

Global Semiconductor Inspection Systems Market 2016-2020

加工时间:2017-03-13 信息来源:EMIS 索取原文[73 页]
关键词:半导体;检测系统;检验系统;晶片检测设备;光学技术
摘 要:

The global semiconductor inspection system market will grow at a CAGR of 11.74% during the forecast period. The need for high-quality and high-performance chips is the main factor for the strong growth of the market.· The wafer inspection system segment, which had a share of 81.96% in 2015, will

grow at a CAGR of 11.27% during the forecast period. The patterned wafer inspection equipment segment accounted for a market share of 88.27% in 2015, while the unpatterned inspection equipment segment contributed 11.73% to the global market.· The mask inspection system segment will grow at a CAGR of 11.27%, contributing 17.66% to the global market by the end of the forecast period.· Foundries, memory manufacturers, and IDMs are the main end-users in the global semiconductor inspection system market. The foundries segment will grow at a CAGR of 12.36%, and the memory manufacturers segment will post a CAGR of

12.44% during the forecast period. APAC dominated the global market with a share of 70.5% in 2015. It will grow at a CAGR of 11.77% during the forecast period.The migration to smaller node sizes (lower than 16 nm) will lead to the commercialization of electron beam technology for defect inspection.· The top three vendors together contribute more than 80% to the global semiconductor inspection system market. In terms of technology used in semiconductor inspection systems, optical technology led the market in 2015, with a share of 83.25%. However, the use of this technology will slow down during the forecast period. E-beam technology will gain considerable ground during the forecast period. It will contribute 50% share by 2020, growing at a very high CAGR over the forecast period · The end-users in the global semiconductor inspection system market include foundries (with a share of 62.35% in 2015), memory manufacturers (with a share of 23.75% in 2015), and integrated device manufacturers (IDMs) (with a share of 13.9% in 2015). Foundries will grow at a CAGR of 12.36%, memory manufacturers will grow at a CAGR of 12.44%, and IDMs will grow at a CAGR 7.4% during the forecast period.


目 录:

PART 01: Executive summary ............................................ 6

Highlights 6

PART 02: Scope of the report ............................................. 8

Definition 8

Base year and forecast period 8

Market reportage 8

Market size computation 9

Market segmentation 9

Geographical coverage 10

Vendor segmentation 11

Common currency conversion rates 12

Top-vendor offerings 13

PART 03: Market research methodology ......................... 15

Research methodology 15

Economic indicators 15

PART 04: Introduction ....................................................... 16

Key market highlights 16

PART 05: Market landscape .............................................. 18

Market overview 18

Wafer inspection 19

Mask inspection 21

Market size and forecast 23

Five forces analysis 25

PART 06: Market segmentation by type ........................... 26

Types of inspection systems 26

Wafer inspection systems 28

Mask inspection systems 29

PART 07: Market segmentation by technology ............... 31

Global semiconductor inspection system market by

technology 31

PART 08: Market segmentation by end-user ................... 33

Global semiconductor inspection system market by enduser

33

PART 09: Geographical segmentation ............................. 35

Global semiconductor inspection system market by

region 35

APAC 37

Americas 38

EMEA 39

PART 10: Market drivers ................................................... 40

Growing number of fabs 40

High requirement for SoC technology 41

Increasing demand for high-precision miniaturized

electronic devices 42

Explosive growth of wireless computing devices 43

Lack of alternatives to photomask technology 43

Growing requirement of semiconductor inspection

systems for R&D purposes 44

PART 11: Impact of drivers ............................................... 45

PART 12: Market challenges ............................................. 46

Need for high initial capital investment 46

High inventory levels in supply chain 46

Dependency on few key suppliers 47

Growing mask complexity 48

Complex semiconductor wafer designs 48

PART 13: Impact of drivers and challenges .................... 49

PART 14: Market trends .................................................... 50

Constant decline in lithography wavelength 50

Growing proliferation of IoT and connected devices 51

High need for semiconductor memory devices 51

Growing acceptance of wearable devices 52

Increase in wafer size 53

Smaller life cycle of mobile devices 54

Growth of smart cities 54

Increasing vehicle automation 55

Development of multi-beam e-beam inspection 56

PART 15: Vendor landscape ............................................. 57

Competitive landscape 57

Key vendors 59

Other prominent vendors 70

PART 16: Appendix ........................................................... 74

List of abbreviations 74

PART 17: Explore Technavio ............................................ 75

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