The continuous miniaturization of microchips along with the requirement for greater degree of functionalities points to the importance of 3D-based design framework across the semiconductor industry. Mobile devices like smartphones, tablets, and notebook or laptops with upgraded functionalities and increased performance are entering the market at regular intervals. The requirement for such enhanced functionalities has led to the inclusion of thousands of electronic components on a limited amount of space inside these devices. This would not have been possible without the use of advanced packaging technology used in semiconductor device manufacturing.

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Definition

Report overview

Base year and forecast period

Geographical segmentation

Common currency conversion rates

Vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

Technology landscape

Industry overview

Global semiconductor industry value chain

PART 05: Market landscape

Market overview

Market size and forecast

Five forces analysis

PART 06: Market segmentation by application

Global 3D semiconductor packaging market by

application 2015-2020

Consumer electronics

Others

PART 07: Geographical segmentation

3D semiconductor packaging market in APAC

3D semiconductor packaging market in EMEA

The Americas

PART 08: Market drivers

PART 09: Impact of drivers

PART 10: Market challenges

PART 11: Impact of drivers and challenges

PART 12: Market trends

PART 13: Vendor landscape

Competitive scenario

Other prominent vendors

PART 14: Market summary

PART 15: Appendix

List of abbreviations

PART 16: Explore Technavio