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全球半导体制造软件市场报告(2017-2021年)

Global Semiconductor Fabrication Software Market 2017-2021

加工时间:2017-07-30 信息来源:EMIS 索取原文[78 页]
关键词:半导体制造;软件;电子设备制造;市场分析
摘 要:

This report considers 2016 as the base year and provides data for the trailing 12 months. The values presented in the report are the actual values for 2016 and have been estimated for the period 2017-2021. 


目 录:

PART 01: Executive summary 6

PART 02: Scope of the report 17

Definition 17

Base year and forecast period 17

Market overview 17

Market size computation 18

Geographical coverage 19

Product segmentation 21

Vendor segmentation 22

Top vendor offerings 22

PART 03: Market research methodology 24

Research methodology 24

Economic indicators 24

PART 04: Introduction 25

Key market highlights 25

PART 05: Market landscape 28

Market overview 28

Market size and forecast 30

Five forces analysis 35

PART 06: Market segmentation by software solutions 36

Global semiconductor fabrication software market for CAE 38

Global semiconductor fabrication software market for IC physical design and verification 39

Global semiconductor fabrication software market for PCB and MCM 40

Global semiconductor fabrication software market for fab management software 41

Global semiconductor fabrication software market for process control software 42

PART 07: Geographical segmentation 43

Semiconductor fabrication software market in APAC 45

Semiconductor fabrication software market in the Americas 47

Semiconductor fabrication software market in EMEA 48

PART 08: Market drivers 49

Growing complexity of semiconductor device designs 49

Increasing requirement for SoC technology 50

Demand for miniaturized electronic devices of high precision across sectors 52

Adoption of FinFET architecture 53

High R&D investments 53

Advent of IoT and connected devices 55

PART 09: Impact of drivers 56

PART 10: Market challenges 57

Constant variability in manufacturing processes 57

High inventory levels in supply chain 57

Threat from open-source and pirated CAM software 58

Continuous updating of software tools 59

Consolidation in end-user industries 59

PART 11: Impact of drivers and challenges 60

PART 12: Market trends 61

High need for semiconductor memory devices 61

Growing acceptance of wearable technology 62

Growth of smart cities 62

Growth in technological convergence 63

Rise in number of fabless semiconductor companies 64

PART 13: Vendor landscape 65

Competitive scenario 65

Key vendors 67

Other prominent vendors 72

PART 14: Appendix 77

List of abbreviations 77

PART 15: Explore Technavio 78


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