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全球非挥发性双列直插内存模块市场报告(2016-2020年)

Global Non-volatile Dual In-line Memory Module Market 2016-2020

加工时间:2017-04-01 信息来源:EMIS 索取原文[63 页]
关键词:内存模块;超级电容器;动态随机存取存储器(DRAM)
摘 要:

Intel plans to release its 3DX point non-volatile dual in line memory module (NVDIMM) by the end of 2016. The adoption rate of this product will be high due to its high speed and low cost when compared to dynamic random access memory (DRAM).In 2016, SMART Modular Technologies released its 32 GB NVDIMM-N. It is the highest density DDR4 NVDIMM-N in the industry. This innovation will help the company grow in the market, as many server manufactures are shifting toward higher density memory echnologies.NVDIMM's superiority in read and write speed and lifespan will hinder the adoption of peripheral component interconnect express solid-state drive (PCIe SSD).This report covers the present market dynamics and the growth prospects of the global NVDIMM market for the period 2016-2020. The market size estimation is done on the basis of total number of NVDIMM shipped globally.


目 录:

PART 01: Executive summary 5

Highlights 5

PART 02: Scope of the report 6

Market overview 6

PART 03: Market research methodology 9

Research methodology 9

Economic indicators 9

PART 04: Introduction 10

PART 05: DDR3 DRAM versus NAND flash 16

PART 06: Market overview 18

Market size and forecast 19

Five forces analysis 23

PART 07: Market segmentation by type 24

NVDIMM-N 24

NVDIMM-F 25

PART 08: Market segmentation by application 28

Market Segmentation of NVDIMMs by Application 28

PART 09: Geographical segmentation 33

Global NVDIMM market by geographical segmentation 33

Americas 34

EMEA 36

APAC 37

PART 10: Market drivers 39

Increasing number of data centers 39

Emergence of IoT 45

Increased use of NVDIMMs for cloud computing 46

Adoption of big data analytics 47

PART 11: Market challenges 50

Scaling of NVDIMMs 50

Packaging and board assembly of NVDIMMs 50

Slow speed of NAND over DRAM 50

PART 12: Market Trends 51

Rapid growth in non-volatile market 51

Adoption of DDR4 technology 51

Advances in super capacitors 51

New product launches 51

Strategic partnership between technology companies 52

Increasing competition among NVDIMM players on 20

nm scaling migration 52

PART 13: Impact of drivers and challenges 53

PART 14: Competitive landscape 54

Competitive scenario 54

Vendor landscape 55

PART 15: Appendix 63

List of abbreviation 63

PART 16: Explore Technavio 65

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