The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the last two decades.

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Report coverage

Base year and forecast period

Geographical segmentation

Common currency conversion rates

Vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

Technology landscape

PART 05: Industry overview

Overview of semiconductor packaging industry

Global semiconductor industry value chain

PART 06: Market landscape

Market overview

Market size and forecast

Five forces analysis

PART 07: Market segmentation by technology

Global chip mounter market by technology

SMT segment

THT segment

PART 08: Market segmentation by application

Global chip mounter market by application

Application segmentation

PART 09: Geographical segmentation

Global chip mounter market by region

APAC

EMEA

Americas

PART 10: Market drivers

Growing adoption of communication-related electronic

gadgets

Increase in chip density

Miniaturization of electronics

PART 11: Impact of drivers

PART 12: Market challenges

Cyclical nature of semiconductor industry

Uncertain global economic conditions

PART 13: Impact of drivers and challenges

PART 14: Market trends

Growing focus on IoT

Increasing automation in automobiles

Emergence of wearable technology

PART 15: Vendor landscape

Competitive scenario

Other prominent vendors

PART 16: Market summary

Market figure snapshot

PART 17: Appendix

List of abbreviations

PART 18: Explore Technavio