关键词：电子行业；热通量热管；安全操作限制装置；热传输系
摘 要：The electronics industry desires compact high-heat-flux thermal management solu- tions for keeping device junction temperatures within the safe operating limit. Loop heat pipes (LHPs) are passive phase change-based thermal transport systems that can satisfy these demands, provided they can be miniaturized to fit inside compact devices and components. This can be achieved by fabricating LHPs on silicon and Pyrex wafers using MEMS microfabrication techniques. Although most of the LHP components can be easily implemented on planar substrates, the wicking structure is a major stumbling block in the successful implementation of these MEMS loop heat pipes.