关键词：半导体封装；保护部件；半导体管芯；集成电路（IC）；印刷电路板（PCB）；输出信号电感
摘 要：Semiconductor packages are plastic, metal, and ceramic components that protect the fabricated integrated circuit (IC) on the semiconductor die. They interconnect the die and the printed circuit board (PCB). These packages provide many advantages to semiconductors like reduction in packaging footprints and output signal inductance.Organic substrates are base layers of individual semiconductor devices and ICs on which other layers are deposited to complete the circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity. Thinner core materials are used to surround them in demanding system applications. A small die (a block of semiconducting material made of silicon or gallium arsenide, with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to the PCB.
目 录：

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Market overview

Top vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

PART 05: Market landscape

Market overview

Market size and forecast

Five forces analysis

PART 06: Market segmentation by packaging technology

Market segmentation by packaging technology

Global SO packaging technology overview

Global GA packaging technology overview

Global flat no-leads packaging technology overview

Global QFP packaging technology overview

Global DIP packaging technology overview

Global other packaging technologies overview

PART 07: Geographical segmentation

Geographical segmentation of global organic substrate

packaging material market 2014-2019

Organic substrate packaging material market in APAC

Organic substrate packaging material market in

Taiwan

Organic substrate packaging material market in Japan

Organic substrate packaging material market in South

Korea

Organic substrate packaging material market in China

Organic substrate packaging material market in North

America

Organic substrate packaging material market in

Europe

PART 08: Key leading countries

Taiwan

South Korea

China

PART 09: Market drivers

Growth drivers

PART 10: Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

Competitive scenario

Key market vendors 2014

PART 15: Key vendor analysis

Ajinomoto

Amkor Technology

ASE Kaohsiung

Mitsubishi Gas Chemical Company

Siliconware Precision Industries

STATS ChipPAC

PART 16: Appendix

List of abbreviation

PART 17: Explore Technavio