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射频发射器阵列的光子集成电路制造

Integrated Photonic Circuit Fabrication for Enabling RF Emitter Array

作者:Hopkins, F. K.; Walsh, K. M.; Benken, A. 作者单位:Louisville Univ., KY. 加工时间:2015-09-09 信息来源:科技报告(AD) 索取原文[23 页]
关键词:芯片;射频脉冲;集成系统;光通信
摘 要:The interim report describes an initial effort to fabricate an Integrated Photonic Circuit (IPC) which provides a means for converting an optical laser signal, that consists of both a narrow-line carrier wavelength and a heterodyned RF signal that are in-phase, to an electrical RF signal that can drive various on-chip components such as an antenna. The IPC would supply a critical missing element for enabling new phased-array radar based on an all- optical architecture. Ge-on-Si technology, the focus of the effort, has specific advantages that are fundamental to nearly all integrated photonic circuits. Its direct energy bandgap, slightly larger than Ge s indirect bandgap, permits band-to-band recombination/generation at an energy that corresponds to light near the standard optical communications wavelength. Ge-on-Si technology, therefore, could enable a host of IPC subcomponents including photodetectors, laser diodes, and enhanced silicon modulators. In addition, such germanium devices can be simply and inexpensively incorporated into a silicon manufacturing process.
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