关键词：射频磁盘;谐振器;热膨胀系数（CTE）
摘 要：Vacuum encapsulation of RF disk and beam resonators is often needed to maintain high quality factor and frequency stability. Conventionally, this is performed at the wafer level by anodic, eutectic, fusion, or glass frit bonding. After wafer dicing, packaging proceeds with die attach to the package substrate and plastic over molding. This process leads to many contacts between materials of different coefficients of thermal expansion (CTE) resulting in packageinduced stress. The focus of this work is to determine the effect of this stress on the temperature stability of micromechanical resonators via finite element analysis (FEA), for applications that do not require attachment to a printed circuit board, such as the sensors in the original vision of Smart Dust.