This report considers 2016 to be the base year and provides data for the trailing 12 months. The values presented in the report are the actual values for 2016 and estimated values for the period 2017-2021.  

PART 01: Executive summary 6

PART 02: Scope of the report 16

Market overview 16

Base year 16

Market reportage 16

Geographical coverage 16

Vendor segmentation 17

Common currency conversion rates 17

Top-vendor offerings 18

PART 03: Market research methodology 21

Research methodology 21

Economic indicators 21

PART 04: Introduction 22

Key market highlights 22

PART 05: Technology landscape 24

Semiconductor IC manufacturing process 24

WLP versus die-level packaging and assembly 27

Roadmap of semiconductor packaging industry 27

Ecosystem of semiconductor IC packaging industry 30

PART 06: Market landscape 32

Market overview 32

Market size and forecast 33

Five forces analysis 35

PART 07: Market segmentation by OSATs and IDMs 36

Global semiconductor chip packaging market by OSATs and IDMs 36

OSATs 37

IDMs 38

PART 08: Market segmentation by packaging techniques 39

Flip-chip wafer bumping 41

2.5D interposers 42

Fan-in WL CSP 43

3D WLP 44

FO WLP/SiP 45

3D IC TSV stacks 46

PART 09: Geographical segmentation 47

Market overview 47

APAC 48

Americas 48

EMEA 49

PART 10: Key leading countries 50

USA 50

Taiwan 50

PART 11: Market drivers 52

Growing number of fabs 52

Increase in miniaturization of electronic devices 53

High adoption of semiconductor ICs in automobiles 54

Increase in number of fabless semiconductor companies 54

PART 12: Impact of drivers 55

PART 13: Market challenges 56

High initial investment 56

Increasing complexity of semiconductor IC designs 56

Rapid technological changes 57

PART 14: Impact of drivers and challenges 58

PART 15: Market trends 59

Development of 3D chip packaging 59

Growing popularity of FOWLP technology 59

Increase in wafer size 59

PART 16: Vendor landscape 61

Competitive scenario 61

Vendor landscape 62

PART 17: Appendix 67

List of abbreviations 67

PART 18: Explore Technavio 69