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全球微机电系统市场报告(2016-2020年)

Global Micro-electrical-mechanical-systems Market 2016-2020

加工时间:2016-12-23 信息来源:EMIS 索取原文[70 页]
关键词:MEMS;使用微加工技术;制造;小型化器件和结构;机械;光学;流体元件;电子设备;相结合
摘 要:

MEMS are miniaturized devices and structures that are made using the techniques of microfabrication. These combine mechanical, optical, and fluidic elements with electronics. The size of MEMS devices can range from less than one micron up to a number of millimeters. These devices are integrated with a number of devices such as smartphones, tablets, wearables, vehicles, medical devices, and industrial devices for carrying out different types of automated functions. Consumer electronics is the largest market for MEMS.


目 录:

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Definition

Source year

Forecast period

Product segmentation

End-user segmentation

Geographical segmentation

Common currency conversion rates

Top-vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

PART 05: Market landscape

Market size and forecast by revenue

Market size and forecast by unit shipment

MEMS ASP forecast 2015-2020

Five forces analysis

PART 06: Market segmentation by product

Global MEMS market segmentation by product

Global pressure sensor MEMS market

Global inertial combos MEMS market

Global gyroscope MEMS market

Global RF MEMS market

Global accelerometers MEMS market

Global optical MEMS market

Global microphone MEMS market

PART 07: Market segmentation by end user

Global MEMS market for consumer electronic segment

Global MEMS market for automotive segment

Global MEMS market for industrial segment

Global MEMS market for medical segment

PART 08: Geographical segmentation

Market overview

Market size and forecast

APAC

EMEA

Americas

PART 09: Market drivers

PART 10: Impact of drivers

PART 11: Market challenges

Accuracy and calibration issues during sensor fusion

Declining prices of MEMS

Design complexity

PART 12: Impact of drivers and challenges

PART 13: Market trends

Advanced MEMS packaging

Increased adoption of smart lifestyle wearable devices

Increasing trend of sensor fusion

Holographic display based on microdisplay

PART 14: Vendor landscape

Competitive scenario

Analog Devices

Bosch

InvenSense

Knowles

STMicroelectronics

Texas Instruments

Other prominent vendors

PART 15: Appendix

List of abbreviations

PART 16: Explore Technavio 


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