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全球滤波连接器市场报告(2016-2020年)

Global Filtered Connectors Market 2016-2020

加工时间:2016-09-15 信息来源:EMIS 索取原文[61 页]
关键词:连接器;抑制;电磁噪声;滤波;二极管;电容器;成本和空间效益;解决方案
摘 要:

The suppression or filtering of electromagnetic noise in connectors can be achieved by adding diodes and capacitors to separate interfering high-voltage or high-frequency noise from the desired lower frequency signals. These connectors are called filtered connectors and have been used in the industry for more than three decades to provide cost- and space-effective solutions to EMI problems. They can be used in multiple applications such as satellites, avionics systems, communications, missiles, consumer electronics, and medical instruments.


目 录:

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Definition

Source year and forecast period

Market reportage

Market size computation

Market segmentation

Geographical coverage

Vendor segmentation

Common currency conversion rates

Top vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

PART 05: Market landscape

Global semiconductor market overview

Wafer-level manufacturing equipment categories

Market overview

Market size and forecast

Five force analysis

PART 06: Market segmentation by application

Global filtered connector market by application

Commercial

Military and aerospace

Industrial

Medical

PART 07: Geographical segmentation

Global filtered connector market by geography 2015

Global filtered connector market by geography 2020

APAC

North America

Europe

RoW

PART 08: Key leading countries

Key leading countries

PART 09: Summary of key figures

PART 10: Market drivers

Proliferation of personal electronic devices

Rapid industrialization in China

Decreasing cost of raw materials

PART 11: Impact of drivers

PART 12: Market challenges

Conformance to stringent regulations and statutory

norms

Rising wage rate and competition

Reliability and durability issues

PART 13: Impact of drivers and challenges

PART 14: Market trends

Rising trend of miniaturization of devices

High use of composite materials

PART 15: Vendor landscape

Competitive scenario

Other prominent vendors

PART 16: Appendix

List of abbreviations

PART 17: Explore Technavio 


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