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全球PCB和MCM电子设计自动化市场报告(2016 - 2020年)
Global Electronic Design Automation for PCB and MCM Market 2016-2020
PART 01: Executive summary
Highlights
PART 02: Scope of the report
Definition
Source year and forecast period
Market segmentation
Market size computation
Geographical coverage
Vendor segmentation
Common currency conversion rates
Top-vendor offerings
PART 03: Market research methodology
Research methodology
Economic indicators
PART 04: Introduction
Key market highlights
MCM technologies
PART 05: Market landscape
Market overview
Market size and forecast
Five forces analysis
PART 06: Market segmentation by application
Market overview
Networking and communications
Automotive
Medical, industrial, and instrumentation
Cellular phone
Aerospace and defense
Computing, storage, and peripherals
Other
PART 07: Geographical segmentation
Global EDA for PCB and MCM market by geography
2015
Global EDA for PCB and MCM market by geography
2020
Americas
APAC
EMEA
PART 08: Key leading countries
US
Japan
China
PART 09: Summary of key figures
PART 10: Market drivers
Increasing complexity in semiconductor device
designs
Surging demand for SoC technology
Miniaturization of electronic devices
Adoption of FinFET architecture
High investments in R&D
Advent of IoT and connected devices
PART 11: Impact of drivers
PART 12: Market challenges
Difficulty in developing scalable design methodologies
Inconsistency in manufacturing processes
High inventory levels in supply chain
Uncertain economic conditions
Regular upgrading of tools
Consolidation in end-user industries
PART 13: Impact of drivers and challenges
PART 14: Market trends
High requirement for semiconductor memory devices
Increasing acceptance of wearables
Growth of smart cities
Increase in technological convergence
Easy accessibility of online EDA tools
Increase in number of fabless semiconductor
companies
PART 15: Vendor landscape
Competitive scenario
Market share analysis
Key vendors
Other prominent vendors
PART 16: Appendix
List of abbreviations
PART 17: Explore Technavio