The semiconductor production equipment industry can be divided into front-end and back-end process equipment. The front-end process includes cutting edge technology and integration. Investments for front-end equipment is more than back-end equipment; it takes up about 60% of the total investment. The front-end process includes silicon wafer process for manufacturing multiple integrated devices and designing of electric circuits on the wafers. 

PART 01: Executive summary 6

PART 02: Scope of the report 17

PART 03: Research Methodology 22

PART 04: Introduction 25

Key market highlights 25

PART 05: Market landscape 27

Market overview 27

PART 06: Market landscape 31

Market size and forecast 31

Five forces analysis 33

PART 07: Market segmentation by equipment type 34

Market overview 34

Wafer processing equipment 35

Test equipment 36

Assembly and packaging equipment 37

Other front-end equipment 38

PART 08: Geographical segmentation 39

Global semiconductor production equipment market by geography 2016 39

Global semiconductor production equipment market by geography 2021 39

APAC 41

Americas 42

EMEA 43

PART 09: Key leading countries 44

Taiwan 44

South Korea 44

China 45

Japan 45

PART 10: Market drivers 46

Increasing demand for semiconductor wafers 46

Growing number of foundries 47

Increasing demand for hybrid and electric vehicles 48

Growth of SoCs 48

PART 11: Impact of drivers 50

PART 12: Market challenges 51

High inventory levels in supply chain 51

Short replacement cycle of end-products 52

Dependency on a few key suppliers 52

Limited number of customers 53

PART 13: Impact of drivers and challenges 54

PART 14: Market trends 55

Increase in wafer size 55

Constant decrease in lithography wavelength 56

Migration to FinFET 57

PART 15: Vendor landscape 58

Competitive scenario 58

Market share analysis 2016 59

Other prominent vendors 71

PART 16: Appendix 75

List of abbreviations 75

PART 17: Explore Technavio 77