Semiconductor packaging and assembly is carried out to provide extra protection to wafers or substrates. The components are first assembled layer on a layer using wires that can conduct electricity. The unpackaged chip is then put into a casing made up of materials, such as metal, plastic, glass, or ceramic, and containing one or more semiconductor electronic components.

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

Key market highlights

PART 05: Market landscape

Overview of semiconductor packaging and assembly

equipment

Ecosystem of semiconductor IC packaging industry

Market overview

Market size and forecast

Five forces analysis

PART 06: Market segmentation by end-user

Market overview

OSATs

IDMs

PART 07: Geographical segmentation

Die bonder equipment market in APAC

Die bonder equipment market in Americas

Die bonder equipment market in EMEA

PART 08: Key leading countries

Taiwan

South Korea

Japan

China

PART 09: Decision framework

PART 10: Drivers and challenges

Market drivers

Impact of drivers on key customer segments

Market challenges

Impact of challenges on key customer segments

PART 11: Market trends

Growing use of 3D chip packaging

Increase in number of OSAT vendors

Increase in M&A in the semiconductor packaging and

assembly market

Advent of FOWLP technology

Automation in automobiles

PART 12: Vendor landscape

Competitive scenario

Major vendors

Other prominent vendors

PART 13: Appendix

List of abbreviations

PART 14: Explore Technavio