关键词：光机电；微机电系统；传感器；探测器；导弹；加热器；光谱
摘 要：This technical report is duplicative documentation of the approved doctorial thesis of one of the co-authors. The research was funded in part by the U.S. Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) for the development of micromechanical sensors under the Army Technology Objective (ATO) of Sensor, Warhead, and Fuzing Technology Integrated for Combined Effects (SWFTICE). Particular technical progress at AMRDEC within this report includes resonant array processing (Chapter 3), electrets integration with Microelectromechanical Systems (MEMS) with localized heater fabrication for wafer bonding and microcharging grids for in-situ charging using microcoronas (Chapter 4), and processing of MEMS transducers (Chapter 5).