AC Coupled Interconnect for Low Power Spaceborne Electronics
作者:Franzon, P. D.Lipa, S. 作者单位:North Carolina State Univ. at Raleigh. 加工时间:2013-12-08 信息来源:科技报告(AD) 索取原文[70 页]
关键词:电子信息;电子;交流耦合;低功率 摘 要:The goal of this project was to provide a demonstration of issues related to laminate packaging, and demonstration of a socket system and a connector system using inductively and capacitively coupled AC interconnect. In addition, we were tasked to deliver a test module for a test in near earth orbit on the TacSat-3 spacecraft. The vast majority of the goals of the project were achieved.