关键词：全球薄膜半导体沉积市场；增长率；半导体集成电路（IC）
摘 要：In 2015, the global thin film semiconductor deposition market was valued at $7.35 billion and is anticipated to reach $14.2 billion by 2020, growing at a CAGR of 14.08%. In terms of geography, APAC was the largest contributor — it accounted for 70.7% of the market in 2015, and is likely to account for 71.08% in 2020. The presence of a significant number of semiconductor integrated circuit (IC) and mobile device manufacturers in APAC is one of the major reasons for the high revenue contribution from this region.
目 录：

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Market overview

Top vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

PART 05: Technology landscape

Types of technologies

PART 06: Market landscape

Market overview

Five forces analysis

PART 07: Market segmentation by technology

Market overview

Market size and forecast

Global thin film semiconductor deposition market by CVD

technology

Global thin film semiconductor deposition market by PVD

technology

Global thin film semiconductor deposition market by

other technology

PART 08: Geographical segmentation

Market overview

Market size and forecast

PART 09: Key leading countries

PART 10: Market drivers

PART 11: Impact of drivers

PART 12: Market challenges

PART 13: Impact of drivers and challenges

PART 14: Market trends

PART 15: Vendor landscape

Competitive scenario

Other prominent vendors

PART 16: Key inferences

PART 17: Appendix

List of abbreviations

PART 18: Explore Technavio