1～10 月，机械工业延续高增长态势，规模以上工业增加值同比增长 11%，高于同期全国工业增加值增速 4.3 个百分点，超七成产品产量实现稳步增长；生产者出厂价格指数自今年来逐月小幅回升；进出口低迷状态持续改善，前三季度，机械工业进出口增速由上年同期的同比下降 4.69%转为增长 9.06%。总体而言，机械行业整体运行平稳，但受原材料价格影响，利润增速有所下滑；固定资产投资低位运行，提质增效任务依然艰巨。展望未来，政策助推环保装备制造业发展，目标产值 1 万亿；轨交设备成长可期；十六部门鼓励民间投资，利好机械高端装备；铁路“十三五”规划发布叠加高铁招标。

Laser refers to light amplification by stimulated emission of radiation, which produces a coherent, collimated, and monochromatic beam of light by exciting atoms to a higher energy level. Lasers are distinguished from other light sources by their coherence. Spatial coherence property of laser enables it to stay narrow over great distances and allows it to be focused on a tight spot. As a result of these properties, they are widely used in applications such as laser pointers, laser cutting, and lithography. Lasers are classified based on the type of lasing medium they use such as gas, optical fiber, solid state, and semiconductor.

Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally. The major benefit of WLP is that wafer fabrication and testing is done on the wafer itself, reducing the cost of WLP with increasing wafer size and decreasing die size.