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全球物理知识产权市场报告(2017-2021年)

Global Physical Intellectual Property Market 2017-2021

加工时间:2017-08-30 信息来源:EMIS 索取原文[75 页]
关键词:半导体知识产权(SIPs);重用设计;核心部件;芯片设计布局; 用户自己使用;向其他用户许可;物理IP;系统级芯片
摘 要:

Semiconductor intellectual properties (SIPs) are considered to be the building blocks or reusable design core components of chip design layout, which are either created by the users for their own use and/or licensed to other users. Physical IPs are referred as the design of building blocks used in the development of SoCs. Physical IPs, which include analog and mixed signal, memory cells, wired interface, wireless interface, and physical library accounted for a revenue share of 32.05% in the global semiconductor IP market.


目 录:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

Key market highlights

PART 05: Industry overview

Semiconductor IP ecosystem

Business models

PART 06: Market landscape

Market size and forecast

PART 07: Market analysis

Five forces analysis

PART 08: Market segmentation by application

Mobile computing devices

Consumer electronic devices

Automotive

Industrial automation

Networking

Others

PART 09: Geographical segmentation

Market overview

APAC

Americas

EMEA

PART 10: Market drivers

Growing complexity of ICs

Intense competition among mobile computing device

vendors

Growing connected devices market

Increase in government initiatives

PART 11: Impact of drivers

PART 12: Market challenges

Complexity in delivering configurable semiconductor

IP

High reuse of semiconductor IP

Integration and verification problems of physical IP

High investment due to increased complexity of IP core

design

PART 13: Impact of drivers and challenges

PART 14: Market trends

Growth in in-vehicle networks

Proliferation of wireless technologies

Decrease in lithography wavelength

Emergence of Fourth Industrial Revolution

Emergence of nanophotonic ICs

PART 15: Vendor landscape

Competitive scenario

Key product launch and strategic collaborations

PART 16: Appendix

List of abbreviations

PART 17: Explore Technavio


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