关键词：导热复合材料；高填充复合材料；聚苯并恶嗪；H型氮化硼；高分子材料
摘 要：This chapter discusses one engineering application of polybenzoxazines as a highly thermally conductive electronic packaging encapsulant. The combination of various useful properties of benzoxazine resins and their resulting polymers has been demonstrated to render a very high thermally conductive polymer composite. Thermal conductivity value as high as 32.5 W/mK in hexagonal boron nitride-filled polybenzoxazine, up to present, remains the highest reported thermal conductivity value in the literature. Other outstanding properties of the resulting composites as an electronic packaging encapsulant are also discussed in this chapter.