Semiconductor materials such as plastic, metal, and ceramic components are used for fabrication and packaging purposes. They can be broadly classified into two types: fab materials and packaging materials. Fab materials are used in different stages of the fabrication process such as etching, oxidation, deposition, and planarization, whereas packaging materials are specifically used for packaging purposes, to increase the reliability of semiconductors. Semiconductor packages protect the fabricated IC on the semiconductor die from external mechanical impact and corrosion and interconnect the die and printed circuit board. Packaging materials provide many advantages to semiconductors, such as reduced packaging footprints and reduced output-signal inductance.

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Definition

Source year and forecast period

Market coverage

Market size computation

Market segmentation

Geographical coverage

Vendor segmentation

Common currency conversion rates

Top vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

PART 05: Market landscape

Global semiconductor market overview

Wafer-level manufacturing equipment categories

Market overview

Market size and forecast

Five forces analysis

PART 06: Market segmentation by material type

Global bonding wire packaging material market by

material type 2015

Global bonding wire packaging material market by

material type 2020

Global bonding wire packaging material market by

gold

Global bonding wire packaging material market by

PCC

Global bonding wire packaging material market by

copper

Global bonding wire packaging material market by

silver

PART 07: Geographical segmentation

Global bonding wire packaging material market by

geography 2015

Global bonding wire packaging material market by

geography 2020

APAC

North America

Europe

ROW

PART 08: Key leading countries

Key leading countries in global bonding wire packaging

material market

PART 09: Summary of key figures

PART 10: Market drivers

Growing transition to copper wire

Rising need for miniaturized semiconductor devices

PART 11: Impact of drivers

PART 12: Market challenges

Limitations of copper wire

Migration to flip chip packaging technology

PART 13: Impact of drivers and challenges

PART 14: Market trends

Silver bonding wire as upcoming alternative

Migration to smaller diameter wires

PART 15: Vendor landscape

Competitive scenario

Other prominent vendors

PART 16: Appendix

List of abbreviations

PART 17: Explore Technavio