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全球铸造服务市场报告(2016-2020年)

Global Foundry Service Market 2016-2020

加工时间:2016-12-21 信息来源:EMIS 索取原文[68 页]
关键词:消费电子设备;半导体芯片;半导体晶片;清洁系统;确保;晶片或芯片;没有污染
摘 要:

Consumer electronic devices are made up of different components, with semiconductor chips being the most important one. The quality of an electronic device is highly dependent on the quality of the semiconductor chip, which undergoes numerous procedures throughout the production process. Each process can contaminate the wafer or chip by imposing some impurities on the surface. As these devices are small in size and are getting smaller with further technical advances, the detection and removal of impurities are becoming more challenging. Hence, a foundry employs semiconductor wafer or cleaning systems during the fabrication process to ensure that the wafer or chip is free from contamination. This also helps the foundry realize a high production yield.


目 录:

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Definition

Source year and forecast period

Market overview

Market size computation

Market segmentation

Geographical coverage

Vendor segmentation

Common currency conversion rates

Top-vendor offerings

PART 03: Market research methodology

Research methodology

Economic indicators

PART 04: Introduction

Key market highlights

PART 05: Semiconductor industry overview

PART 06: Market landscape

Market overview

Market size and forecast

Five forces analysis

PART 07: Market segmentation by end-user

Global foundry service market by end-user 2015

Global foundry service market by end-user 2020

Communications

Consumer electronics

Computer

Others

PART 08: Market segmentation by business type

Global foundry service market by pure-play foundries

Global foundry service market by IDMs

PART 09: Geographical segmentation

Global foundry service market by geography 2015

Global foundry service market by geography 2020

Foundry service market in APAC

Foundry service market in Americas

Foundry service market in EMEA

PART 10: Market drivers

Era of wireless computing devices

Growing complexity of IC designs

Declining cost per function of ICs

Requirement for enhanced display functionality in

consumer electronic devices

Short replacement cycle of mobile devices

Rising application of SOCs across devices

PART 11: Impact of drivers

PART 12: Market challenges

Rapid technological changes

Uncertain global economic conditions

Limited number of customers

Dependency on limited key suppliers

High inventory levels in supply chain

PART 13: Impact of drivers and challenges

PART 14: Market trends

Automation in automobiles

Increasing adoption of FinFET architecture

Development of 3D chip packaging

Rising number of fabless semiconductor companies

Growth of smart cities

PART 15: Vendor landscape

Competitive scenario

Key vendor mapping

Key vendors

Other prominent vendors

PART 16: Appendix

List of abbreviations

PART 17: Explore Technavio 


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