Outsourced semiconductor assembly and test refers to services offered by third-party vendors. Some of the common offerings of the companies in the market include wa fer p rocessing capability, package redesign, and characterization with thermal analysis and qualification, burn-in, life-testing, and several other techniques.

1. Introduction 

2.Research Approach and Methodology 

3. Market Overview 

4. Market Dynamics 

5. Market Segmentation - by Service 

6. Market Segmentation - by Type of Packaging 

7. Market Segmentation - by Application 

8. Market segmentation - by Region 

9. Competitive Landscape - Key Vendor Profiles 

10. Investment Analysis 11. Future of the Market