Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally. The major benefit of WLP is that wafer fabrication and testing is done on the wafer itself, reducing the cost of WLP with increasing wafer size and decreasing die size.

PART 01: Executive summary

Highlights

PART 02: Scope of the report

Market coverage

Base year and forecast period

Vendor segmentation

Market segmentation

Geographical segmentation

PART 03: Market research methodology

Research methodology

Economic indicators

PEST analysis

PART 04: Introduction

Key market highlights

PART 05: Technology landscape

Semiconductor IC manufacturing process

WLP versus die-level packaging and assembly

Roadmap of semiconductor packaging industry

Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape

Market size and forecast

Five forces analysis

PART 07: Market segmentation by application

Global fan-in WLP market by application

Analog and mixed ICs

Wireless connectivity

Logic and memory ICs

MEMS and sensors

CMOS image sensors

PART 08: Geographical segmentation

Global fan-in WLP market by geography 2015-2020

APAC

North America

Europe

PART 09: Market drivers

High demand for miniaturized electronics

Growing application of semiconductor ICs in IoT

Increasing complexity of semiconductor IC designs

Surging demand for semiconductor wafers

PART 10: Impact of drivers

PART 11: Market challenges

Cyclical nature of semiconductor industry

Rapid technological changes in wafer processing

PART 12: Impact of drivers and challenges

PART 13: Market trends

Increase in wafer size

High adoption of semiconductor ICs in automobiles

Short replacement cycle of mobile devices

PART 14: Vendor landscape

Competitive scenario

Key vendors

Other prominent vendors

PART 15: Market summary

PART 16: Appendix

List of abbreviations

PART 17: Explore Technavio