Semiconductor IP is generated from multiple data sources, file systems, and internal databases. Currently around 60% of IP is internally developed, 20% from the foundry portfolio library, and another 20% from third-party IP vendor licenses.The leading MNCs such as IBM, Apple, Qualcomm, Intel, Texas Instruments, and Samsung along with the semiconductor foundries will be integrating system on chip (SOC) and 3D/TSV designs into high level and highly complex custom applications, during the forecast period. To make this happen, these foundry vendors and
companies will be using different types of internal and third-party IP solutions for major applications.This report considers 2015 as the base year. The values presented in the report are the actual values for 2015 and have been estimated for the period 2016-2020 on the basis of primary and secondary research.

PART 01: Executive summary ............................................ 6

Highlights 6

PART 02: Scope of the report ............................................ 8

Definition 8

Source year and forecast period 8

Market overview 8

Market size computation 8

Market segmentation 9

Geographical coverage 10

Vendor segmentation 11

Common currency conversion rates 12

Top-vendor offerings 13

PART 03: Market research methodology ......................... 15

Research methodology 15

Economic indicators 15

PART 04: Introduction ....................................................... 16

Key market highlights 16

PART 05: Industry overview ............................................. 18

Semiconductor IP ecosystem 18

Business models 20

PART 06: Market Landscape ............................................. 22

Market overview 22

Market size and forecast 23

Five forces analysis 25

PART 07: Market segmentation by application .............. 26

Mobile devices 28

Consumer electronics 29

Automotive 30

Industrial automation 31

Networking 33

Healthcare 34

PART 08: Market segmentation by type ........................... 36

Processor IP 37

Physical IP 38

Digital IP 39

PART 09: Market segmentation by end-user ................... 41

Fabless semiconductor companies 42

IDMs 43

PART 10: Geographical segmentation............................. 45

Americas 46

APAC 47

EMEA 48

PART 11: Market drivers ................................................... 50

Complex chip designs and use of multi-core

technologies 50

Increase in production of mobile devices 51

Large-scale utilization of SOCs 53

Government initiatives in support of semiconductor

industry 54

PART 12: Impact of drivers ............................................... 56

PART 13: Market challenges ............................................. 57

Delivery of configurable semiconductor IP 57

High reuse of semiconductor IP 58

Integration and verification of semiconductor IP 59

High investment due to increased complexity of IP core

design 59

PART 14: Impact of drivers and challenges .................... 61

PART 15: Market trends .................................................... 62

Decrease in lithography wavelength 62

Increase in number of smart cities globally 63

Growing adoption of automation in automobiles 64

Proliferation of IoT 64

PART 16: Vendor landscape ............................................. 66

Competitive scenario 66

Key vendors 69

Other prominent vendors 80

PART 17: Appendix ........................................................... 82

List of abbreviations 82

PART 18: Explore Technavio ............................................ 84