IC packaging provides the physical/mechanical support for the device and is also responsible for the interconnection between the chip and external terminal, such as the printed circuit board (PCB). The encapsulation helps in the prevention of physical damage and corrosion of the metallic parts; the type of package used in manufacturing IC depends on various parameters, such as power dissipation, size, cost, and other requirements. The increasing trend of miniaturization is driving the demand for advanced packaging. The advent of 5G, which influenced the demand during 2018, is expected to be continued, as the use of FCBGA in 5G base stations and HPCs is increasing in countries that adopt the communication technology, worldwide. FCCSP holds a prominent demand share, which is driven by smartphones, wearables, and other consumer electronics. Over the coming years, the demand for advanced IC substrate is expected to increase even further due to growth in the global demand for 5G enabled smartphones and smart wearables. Due to the 2018's shortage of substrate, which was driven by the demand from 5G vendors, fabless manufacturers are pushing substrate manufacturers for capacity and are partnering with increasing number of suppliers to cover their requirements.

1. INTRODUCTION

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET INSIGHTS

5. MARKET DYNAMICS

6. MARKET SEGMENTATION

7. KEY VENDOR PROFILES

8. INVESTMENT ANALYSIS

9. FUTURE OF THE MARKET