This segment describes in detail the different component types of radiation-hardened electronics. The component segment includes microprocessors and controllers, sensors, application-specific integrated circuits, field-programmable gate array, memory, power sources, discrete semiconductors, and analog and mixed signals, among others. The microprocessor and controllers segment is expected to capture a maximum market share of 24.30% by 2025, witnessing a growth rate of 3.87% CAGR within the forecast period. Technological advancement in various components like sensors, microprocessors, and controllers are increasing operational efficiency. The introduction of new manufacturing techniques like laser sintering of components has significantly reduced the manufacturing cost and manufacturing time, resulting in better services and customer engagement. Major industry players operating within the vertical encompass BAE Systems, Cobham plc, Data Device Corporation, Honeywell, International, IBM, Infineon Technologies, Microchip Technology, Micropac Industries, Renesas Electronics Corporation, Solid State Devices, STMicroelectronics, Texas Instruments, Inc., The Boeing Company, and Xilinx, among others.

1. Market Dynamics 

2. Competitive Insights 

3. Industry Analysis

4. Global Radiation-Hardened Electronics Market, 2020 to 2025 

5. Global Radiation-Hardened Electronics Market (by Manufacturing Technique) 

6. Global Radiation-Hardened Electronics Market (by Component) 

7. Global Radiation-Hardened Electronics Market (by End User) 

8. Global Radiation-Hardened Electronics Market (by Region)