In el ectronics manufacturing, IC (integrated circuit) packa ging is the final s tage of semiconductor device fabrication, in which, the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion. The increasing efforts to make the electronic packaging highly resourceful has led to amplified usage in a myriad of applications. The reduction in package size is inversely proportional to the power dissipation. Therefore, the players in the market are striving to develop semiconductors that can retain power with reduced size. For instance, NXP semiconductors achieved 55% reduction in package size for its transistors range by retaining the same power performance，both devices take up an area space of 2 mm by 2 mm. These trends drive the growth of the miniaturized semiconductor and IC packaging markets. This has also resulted in the development of three-dimensional integrated circuits (3D IC) technology, which is increasingly adopted across various space-constrained applications, including portable consumer electronic devices, sensors, MEMS, and industrial products, as it increases the overall performance of the products regarding speed, durability, low power consumption, lightweight, and memory.

1. INTRODUCTION 

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY 

4. MARKET INSIGHTS 

5. MARKET DYNAMICS 

6. MARKET SEGMENTATION 

7. COMPETITIVE INTELLIGENCE - KEY VENDOR PROFILES 

8. INVESTMENT ANALYSIS 9. FUTURE OUTLOOK