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全球外包半导体封装测试市场报告（2021-2028年）
Global Outsourced Semiconductor Assembly and Test Market, 2021-2028
Outsourced semiconductor assembly and test (OSAT) are vendors that offer third-party IC-packaging and test services. Such vendors pack semiconductor devices that are made by foundries as well as test those devices prior shipping to the market. Companies operating in the market innovative and cost-effective solutions that deliver processing speeds, higher performance, and functionality with a reduction in space in electronic devices.
CHAPTER 1: INTRODUCTION
CHAPTER 2: EXECUTIVE SUMMARY
CHAPTER 3: MARKET OVERVIEW
CHAPTER 4: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY SERVICE TYPE
CHAPTER 5: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PACKAGING TYPE
CHAPTER 6: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY APPLICATION
CHAPTER 7: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY REGION
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