The LDS technology is one of the fastest expanding segments of the molded interconnect devices (MID) market. With the miniaturization trend gaining prominence across various industries, the LDS market is growing in popularity by allowing smaller designs with integrated functionalities. The era of modern electronics has presented manufacturers with many challenges. However, the introduction of LDS antenna technology offers an effective way to overcome these challenges, by offering a high degree of freedom in terms of metallization shape, thus, allowing improved radiation performance. Previously, 3D molded interconnect devices (MIDs) were hailed as a breakthrough in electronics. They were expected to eliminate conventional circuit boards by putting conductive paths directly onto the surface of molded plastic devices.

1. INTRODUCTION 

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY 

4. MARKET INSIGHTS 

5. MARKET DYNAMICS 

6. MARKET SEGMENTATION 

7. COMPETITIVE INTELLIGENCE – COMPANY PROFILES 

8. INVESTMENT ANALYSIS

9. FUTURE OF THE MARKET