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全球模块电脑市场报告(2020-2027年)

Global Computer on Module Market, 2020-2027

加工时间:2021-02-01 信息来源:EMIS 索取原文[240 页]
关键词:模块上计算机;嵌入式系统;COM解决方案;高度集成 ;RAM;散热器;芯片组
摘 要:

Computer on module is a subtype of an embedded system. COM solutions are usually very compact and highly integrated. COMs are based on industry standards with long life cycles and help customers reduce the time-tomarket for new products. Computer on modules are built up by integration of different components in a single module. The component of the COM includes processor, RAM, heat sink, chipset, operating system, and other peripherals. The computer on module allows designers to customize their carrier boards with the functions they need, allowing them to build a perfect embedded carrier board to fit their chassis.


目 录:

CHAPTER 1: INTRODUCTION 

CHAPTER 2: EXECUTIVE SUMMARY 

CHAPTER 3: MARKET OVERVIEW

CHAPTER 4: GLOBAL COMPUTER ON MODULE MARKET, BY PROCESSOR

CHAPTER 5: GLOBAL COMPUTER ON MODULE MARKET, BY FORM FACTOR

CHAPTER 6: GLOBAL COMPUTER ON MODULE MARKET, BY INDUSTRY VERTICAL

CHAPTER 7: COMPUTER ON MODULE MARKET, BY REGION

CHAPTER 8: COMPETITIVE LANDSCAPE

CHAPTER 9: COMPANY PROFILES


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