Chemical mechanical planarization (CMP) equipment usually refers to chemical mechanical planarization equipment. It is a process used in semiconductor manufacturing to flatten and smooth surfaces on wafers. CMP involves the use of a slurry containing abrasive chemicals and polishing agents, along with a polishing pad, to remove or polish away irregularities on the surface of the wafer. This process is crucial for creating the precise and flat surfaces needed for the fabrication of integrated circuits (ICs).