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全球3D半导体封装市场报告(2016-2020年)
The continuous miniaturization of microchips along with the requirement for greater degree of functionalities points to the importance of 3D-based design framework across the semiconductor industry. Mobile devices like smartphones, tablets, and notebook or laptops with upgraded functionalities and increased performance are entering the market at regular intervals. The requirement for such enhanced functionalities has led to the inclusion of thousands of electronic components on a limited amount of space inside these devices. This would not have been possible without the use of advanced packaging technology used in semiconductor device manufacturing.
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全球汽车增强现实市场报告(2016-2020年)
AR in vehicles is an advanced version of the existing HUD systems. It ensures that the pertinent information is situationally and sometimes interactively displayed in front of the driver. The information is displayed in a slightly distant field of vision as convenient — either on the windshield or another transparent screen placed nearby.
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全球发光二极管封装设备市场报告(2016-2020年)
The numerous benefits of LED lights have aided their growth traction among endusers. They are preferred over incandescent bulbs and compact fluorescent lamps (CFLs) as they are energy efficient (they consume almost 75% less energy than other bulbs) and have a long lifespan (which is pegged at 60,000 hours, compared to 1,500 hours of incandescent bulbs and 8,000 hours of CFLs). These features are the main reasons for the continued growth of LED lights, which are also known as green lighting systems.
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全球打印机耗材市场报告(2016-2020年)
The global printing market consists of printers and supplies. In the past, printing was restricted to printing or publishing establishments. The emergence of home or office digital printers and a rapid increase in the number of internet users worldwide have revolutionized the printing market. Digital printing has become increasingly popular and help boost the demand for printer supplies. However, the market faces challenges such as increased digitization, adverse currency rates, and ever-decreasing demand for physical printing content. We expect the market to decline during the forecast period due to these challenges.
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全球芯片安装技术市场报告(2016-2020年)
The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the last two decades.
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全球指纹识别模块市场报告(2016-2020年)
Securing data and assets has become a key concern for banks, government organizations, telecommunications firms, and hospitals, as well as for individuals. Keys, identity badges, and numeric keypads were widely used to prevent unauthorized access to data and locations. With technological advances, two-factor authentication was introduced, where individuals could gain access into secure premises only after they were authenticated twice by employing hardware devices and numeric codes. However, two-factor authentication has also become insecure as hackers were able to gain access to hardware devices and obtain numeric codes.