全球焊线封装材料市场报告(2016-2020年)
Semiconductor materials such as plastic, metal, and ceramic components are used for fabrication and packaging purposes. They can be broadly classified into two types: fab materials and packaging materials. Fab materials are used in different stages of the fabrication process such as etching, oxidation, deposition, and planarization, whereas packaging materials are specifically used for packaging purposes, to increase the reliability of semiconductors. Semiconductor packages protect the fabricated IC on the semiconductor die from external mechanical impact and corrosion and interconnect the die and printed circuit board. Packaging materials provide many advantages to semiconductors, such as reduced packaging footprints and reduced output-signal inductance.