A UAV GCS is a land-based control center that offers the facilities for human control of UAVs. However, this is typically referred to as a Mission Control Center. It may also refer to a system for managing rockets inside or above the atmosphere.

The global hemostats and tissue sealants market was sized near USD 6931.42 million in 2023 in terms of value. Hemostatic agents and tissue sealants are frequently employed in reconstruction during surgical repair, to stop excessive blood loss. Thrombin sealant, fibrin glue, bovine serum/albumin/glutaraldehyde, and gelatin matrix are some major products offered in the market. Each of these agents has a unique mechanism, price, and use. There are different types of diseases that are treated by different surgeries, but surgery has long been concerned about blood loss. There have long been techniques to stop bleeding and mend wounds. Numerous hemostatic medications and tissue sealants have been created during the past 20 years and are being utilized in a variety of surgical specialties. Hemostatic agents are designed to halt bleeding either through mechanical means or by enhancing the natural coagulation cascade. On the other hand, tissue sealants are products that adhere to and seal defects in tissue, promoting hemostasis and facilitating the healing process. The hemostatic agents function by physically blocking or promoting clot formation, while tissue sealants work by creating a barrier that supports tissue repair and regeneration. The selection of the appropriate agent depends on the specific clinical situation and the patient's individual needs. Healthcare professionals must carefully consider the characteristics of each product and their potential benefits and risks when deciding on the most appropriate treatment option.

The study tracks the revenue accrued from sales of ultraviolet disinfection equipment used in applications such as surface disinfection, airborne disinfection, water and wastewater, process water, food, and liquid offered by market vendors worldwide. All the market data and forecasts are reported in terms of revenue (USD billion) from 2023 to 2030, considering 2024 as a base year and 2025 to 2030 as the forecast period.

The market by value in this report is defined as the revenues that enterprises gain from goods and/or services sold within the specified market and geography. • Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

Tower cranes are preferred for the construction of high-rise buildings. They consist of two major parts, a mast and a jib. Tower cranes provide a large picking radius and can operate in confined areas. Hence, their use improves operational efficiency.

7 月美国新能源汽车销量 14.4 万辆，同比+14.9%，环比+19. 9% ，渗 透率 10.5%，同比+11.3pct，环比+1.2pct。其中纯电销量 11. 4 万 辆，同比 +11.5%，环比+22.7%，插混销量 3.0万辆，同比+30.2%， 环比+10.1%。7 月美国新能源汽车销量强势反弹，主要是大而美法 案落地后 9 月 30 日 7500 美元联邦税收抵免政策将提前终止，以及 经销商加大促销力度，引发消费者集中抢购。其中售价 3- 4 万美元 的中端车型对 7500 美元补贴依赖度相对更高，包括雪佛兰 Equino x 销量 0.85 万辆（环比+63.4%）、本田 Prologue 销量 0.63 万辆（环 比+125.7%）成为主力。

存储器是数字信息的重要载体，第三方模组厂聚焦广泛细分市场。 存储器是IT基础设施三大核心板块之一，市场规模占集成电路比重 约30%，是数字信息的重要载体。存储产业链从上至下分别为：上游 原厂、主控芯片、封装测试、存储模组与产品供应商。其中，存储 原厂掌握产业链核心技术，推动技术迭代与标准制定，通过规模效 应锁定下游大客户，保证产能的高效利用，由于行业门槛较高，市 场话语权被海外厂商主导；第三方独立模组厂商不具备晶圆生产能 力，其核心价值在于系统集成能力与良好的响应机制，更多聚焦于 消费电子配件、工控、安防、车载电子、渠道分销等细分领域，通 过聚焦长尾市场以满足下游细分客户充分且广泛的定制化需求。

核心观点：2025 年 8 月 20 日，海关总署发布 2025 年 7 月逆变器出 口数据。整体来看，2025 年 7 月，我国逆变器出口金额为 65.05 亿 元，环比下降 1.08%，同比增长 16.02%，环比小幅回调，同比高增 长。2025 年 1-7 月，我国逆变器累计出口金额为 369.71 亿元，同比 增长 8.63%，市场表现较好。

电气设备 8112 上涨 2.28%，表现弱于大盘。（本周，8.18-8.22）新能源汽车涨 4%，光伏涨 3.39%，锂电 池涨 2.71%，电气设备涨 2.28%，核电涨 2.21%，风电涨 0.5%，发电设备涨 0.04%。涨幅前五为科泰电源、 南风股份、天融信、科士达、泰豪科技；跌幅前五为江苏神通、澳洋顺昌、禾望电气、宝光股份、大金重 工。

晶圆代工是指专门从事半导体晶圆制造生产，接受其他集成电路（IC）设计公司的委托制造，而不从事设计。晶圆代工是半 导体产业中的重要环节之一。晶圆代工行业产业链上游为半导体材料、设备及相关设计服务供应环节，产业链中游为晶圆代工加工服务环节，产业链下 游为晶圆封装测试环节，以及消费电子、半导体、光伏电池、工业电子等晶圆终端应用领域。晶圆制造工艺大致可分为先进逻辑工艺与特色工艺；按制 程可分为先进制程和成熟制程，14nm 以下的为先进制程，28nm 及以上的为成熟制程。随着制程节点的演进，所需设备的投资额大幅上升，特色工艺 （一般在40nm及以上）每5万片晶圆产能所需设备投资额在二三十亿美元，而先进制程（28nm及以下）所需的投资额至少在40亿美元以上。